Infrastructure Engineer III - Software Packaging at JPMorgan Chase, Columbus, OH

Infrastructure Engineer III - Software Packaging at JPMorgan Chase in Columbus, OH. Est. up to $130k. Apply with swipeandhired.

Senior Software Packager responsible for building, testing, and supporting enterprise application packages for Windows 11 and macOS, with supporting release workflows across Windows Server 2025. Owns packaging end-to-end (intake, scripting, validation, deployment readiness), serves as an escalation point for complex install issues, and partners with engineering/operations/app owners to deliver reliable upgrades at scale. Uses AI effectively to accelerate troubleshooting, script development, and documentation—while validating results and operating within change-control and risk standards.