Principal Mechanical Engineer at Skyworks Solutions

Principal Mechanical Engineer at Skyworks Solutions. Est. up to $130k. Apply with swipeandhired.

You will be a Principal Mechanical Design Engineer with Skyworks SSPA hardware engineering team, playing a pivotal role in the mechanical design and development of high-power microwave and millimeter-wave amplifiers, subsystems, and fully integrated LRUs, driving innovation, performance, and reliability across complex products and systems.

Responsibilities

• Partner closely with SSPA engineering disciplines, senior program leadership, production, and quality teams to drive successful outcomes.
• Design high-performance electronics and RF systems, including ruggedized enclosures, RF subassemblies, PCBAs, harnesses, and cables.
• Develop efficient thermal management solutions for high-power electronics, including liquid cold plates and advanced air-cooling strategies (fans, blowers, and ram-air).
• Select and specify materials, components, and manufacturing processes to meet size, weight, power, cost, environmental, and schedule objectives.
• Proactively identify and mitigate risks through rigorous analysis and well-defined verification testing.
• Perform detailed thermal analysis, from system-level modeling to die/channel temperatures; structural FEA analysis including shock, vibration, and acceleration assessments.

Required Experience and Skills

• Bachelor of Science or Masters degree in Mechanical Engineering or relevant discipline.
• Minimum of 10 years experience in mechanical design of ruggedized electronics.
• Demonstrated expertise in FEA-based thermal and structural analysis of electronics and electronics enclosures.
• Strong background in technical data package development, including BOM creation, 2D drawings, and 3D modeling.
• Working knowledge of GD&T (Geometric Dimensioning and Tolerancing).
• Excellent written and verbal communication skills with the ability to collaborate effectively across teams.
• Proficiency in Microsoft Office applications (Excel, Word, PowerPoint)..

Desired Qualifications

• Experience designing electronics packaging for microwave and millimeter wave circuits, modules and antennas.
• Experience with military and aerospace specifications: MIL-STD-810, MIL-STD-461, DO-160.
• Experience with Solidworks, Flotherm CFD, Ansys Structures FEA.
• Proven ability to manage multiple tasks and programs.

This position is not eligible for visa sponsorship by the Company.

This position requires a Security Clearance. Applicant must be a US Citizen and have the ability to obtain and maintain a US Government security clearance.

#LI-KR1